PCB-IC CARRIER BOARD DEFECT IDENTIFICATION

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PCB-IC CARRIER BOARD DEFECT IDENTIFICATION

LCK10G

Used for automatic and laser marking of scrap units on carrier products, which facilitates efficient and accurate identification of subsequent processes, and improves the product yield and process efficiency of customer factories.

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Product Data

Equipment characteristics

Double-station operation to realize high-speed processing of bad board marks on IC substrate
Configure energy monitoring system to ensure the stability of product processing effect
It can automatically identify the front end process mark, or connect to the customer system to directly obtain the location information of the scrap board for marking
The piracy mechanism realizes double-sided processing of the product, no adjustment is required when changing materials, which improves production efficiency and ease of use

	ITEM	MAIN TECHNICAL PARAMETERS
Laser system	Laser type	Green laser 532nm
	Average output power	10W
	Field lens scanning range	150x150mm
Main configuration	Working platform	Dual linear motor platform
	Vision system	Industrial CCD positioning and code reading system
	Condition monitoring	Laser energy monitoring system
	Automatic loading and unloading system	Loading and unloading drawer, vacuum adsorption system
Processing performance	Processing size range	50x70 – 120x300mm
	Mark processing accuracy	±0.01mm
	Overall machining accuracy	±0.05mm
	Processing board thickness	0.1mm – 1.2mm
Use environment	Power supply specifications	Temperature 10 – 35℃/Humiditiy<65%
Use environment	Environmental	2800mm(W) x 2000mm(L) x 2000mm(H)

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PCB-IC CARRIER BOARD DEFECT IDENTIFICATION

LCK10G

Product Data

Samples

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