HGTECH

en
Full Automatic Wafer Marking Equipment
Wafer Marking Series
For the pan semiconductor and 3C industries, it is applied to various types of identification of Si, Gan, SiC, glass and surface coating materials, and is applicable to 8-inch and above wafers.

Product Data

Product advantages:

  • Picosecond light sourceis used, good effect

          Picosecond light source is used to mark / code on the material surface, with small thermal impact and good effect

  • Marking / coding support multiple formats

          Support various formats: QRcode, dmcode, line text and other formats

  • Support information uploading

          Equipped with code reading module to support information uploading to MES system

  • High compatibility and automation

          The equipment is compatible with 8-12inch wafers, fully automatic loading and unloading

  • Automatic switch, saving labor

          Equipped with load mechanism, which can automatically open / close the wafer cassette

  • Marble base, high stability

          Marble base, stable optical path system, thus ensuring high-quality optical transmission

 

Sample display:

Various wafer marking diagrams

laser marking

HD S2113

Main parameters

Laser

Average output power

≥5W(optional)

Pulse width

<10ps

Laser wavelength

Lamp Source
Linear motor parameters
CCD positioning system
Code reading system
Motor stroke

450*650mm

Pixel 12 million pixels, positioning accuracy 0.003mm
Pixel

600 million pixels

Machining accuracy

Positioning accuracy

≤±0.03mm

Machining dimensional accuracy

≤±0.02mm

Handling robot Number of robot arms Single / double arm

Finger

Clamping / adsorption

Others

Charging machine

Yes

Mapping

Yes

Edge finder

8- 12inch is compatible

General indicators Cleanliness level Hundred level 500

Size

1900mm*1800mm*1950mm(main body)

Weight

About 2.5t

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