Semiconductor Wafer Defect Detection Equipment
Wafer Defect Detection Series
For the mid stream wafer manufacturing enterprises and downstream packaging and testing enterprises in the semiconductor industry chain, a multi-channel bright and dark field parallel detection system developed independently is adopted to detect the appearance defects of semiconductor wafers and grains with graphics.
Fast-speed
High-precison
High-efficiency
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Product advantages:
- Available in a variety of sizes
This equipment can be used for 4-8 inch patterned wafers
- Can detect a variety of defects
Detect defects such as scratch, back collapse, color difference, crack, scratch, metal residue and metal loss
- High precision resolution
System resolution: 0.2-0.8 μ m
- Fast detection speed
Patterned wafer: 15 minutes / wafer when the number of defects is less than 200
Sample display:
The gold plating layer falls off
Crackle
Coating surface detection
Scratch
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