Semiconductor Wafer Thickness Measuring Equipment
Wafer Thickness Measuring Series
Facing the raw material production enterprises in the upstream of the semiconductor industry chain, the independently developed spectral confocal measurement system is used to detect the size and flatness of semiconductor raw and epitaxial wafers.
Fast-spped
High-accuracy
Wide-scope
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Product advantages:
- Wide application range
Used for 4-8 inch original wafer, substrate and epitaxial wafer of various materials and polishing conditions
- High measurement accuracy
Thickness range: 0-1mm measurement accuracy: ± 1 μ M repetition accuracy: 0.2 μ m
- Short measurement time
Measurement time: 30s / PCS (according to the customer's detection trajectory)
Sample display:
Sample 1
Sample 2
Sample 3
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