HGTECH, a leading provider of laser equipment and solutions, successfully participated in the 2023 Munich Shanghai Optics Fair held from July 11th to 13th. The exhibition booth attracted a steady stream of visitors who were eager to explore HGTECH's innovative laser equipment. HGTECH showcased a comprehensive range of solutions and advanced technologies catering to the 3C electronics, semiconductor, and electric vehicle sectors.

Fully Automatic IC Packaging Marking Equipment

This equipment is used for marking the package surface of semiconductor chips. It enables simultaneous automatic loading and unloading, as well as automatic adjustment of track width, effectively improving process yield and efficiency.

• High precision: It can accommodate products with a warpage of 2-5mm and achieve a marking precision of ±0.05mm.
• Excellent compatibility: It is compatible with automated marking of warped boards, flat boards, and flexible boards. It can be paired with different types of laser marking machines. Suitable substrate sizes: 180-270mm (length) 50-100mm (width).
• System integration: Developed proprietary software that enables seamless integration with the client's MES data system, providing a competitive pricing advantage.

Substrate Surface Defect Inspection Equipment

Targeted at upstream raw material manufacturers and midstream wafer production companies in the semiconductor supply chain, our independently developed optical bright-field and dark-field inspection system is designed to detect surface defects on semiconductor substrates, epitaxial wafers, and blank wafers.

Suitable for 4-8 inch wafers, substrates, epitaxial wafers, and blank wafers.

Detects defects such as particles, pits, protrusions, scratches, stains, cracks, and more.

System resolution ranges from 1-10μm.

LCF0120A Auto laser cutting machine

Specifically developed for ceramic cutting, scoring, and hole drilling, this equipment is suitable for various types of ceramics such as alumina, aluminum nitride, silicon nitride, and also compatible with cutting various metal materials.

• High specialization: Configured with lasers based on the ceramic material, enabling professional cutting of various ceramic products.
• Efficient cutting: Designed with universal processing fixtures, enabling efficient cutting of various shapes with a processing accuracy of up to ±25μm.
• Independent development: Independently developed software allows for quick creation and switching of new product data in just 3 minutes.
• User-friendly operation: Direct access to the product process database enables even non-specialized technicians to operate the equipment for batch production quickly.
• Rapid focusing: Equipped with a laser rapid focusing system and a visual system for product positioning, eliminating the need for tedious manual focusing tests.
• Clean production: The equipment features a fully sealed design and is equipped with an efficient dust extraction and smoke purification system, reducing dust pollution.

Intelligent manufacturing experience

To provide attendees with an immersive and captivating experience of laser manufacturing, HGTECH presents an interactive automated production line for customized laser-inspired creative products.

• Automation: The production line integrates wireless signal transmission, automated loading and unloading, visual recognition, laser customization marking, visual inspection, and fully automated packaging processes.
• Customization: Customers can choose from different product styles, and personalized customization is achieved through laser marking.
• Environmental-friendly: The use of laser technology eliminates the need for ink consumables, ensuring a clean and eco-friendly production process.

By participating in the 2023 Munich Shanghai Optics Fair, HGTECH has further solidified its position as a leading provider of laser equipment solutions for the semiconductor and 3C electronics industries. With a commitment to innovation, exceptional quality, and customer satisfaction, HGTECH continues to drive advancements in laser technology, empowering industries to achieve new levels of precision and efficiency.